How to solder surface-mount devices

Soldering surface-mount components, also known as SMT or SMD, is completely different than soldering through-hole components. They are not only smaller but need a completely different technique of soldering. The old adage of heating metal first, not the solder, does not work with SMD components. Different SMD components also require different techneques.

=Chip resistors, capacitors, inductors, and tantalum capacitors= The technique for soldering chip resistors, chip capacitors, chip inductors, and tantalum capacitors are the same. Each of the above can be soldered using an inexpensive soldering iron with a fine tip. Working with integrated circuits, because of the close spacing of the pins, requires different tools and techniques in order to be successful.


 * Sizes
 * chip resistor, chip capacitor, and chip inductor
 * 1210
 * 1206
 * 805
 * 603
 * 402
 * 201
 * Less Common (larger): 6927, 4527, 3637, 2515, 2512, 2012, 2010, 1812

==Chip resistor/capacitor arrays or networks=

=Gull-wing chips=

small pitch
=Quad flat package (QFP)=

=Ball grid array (BGA)= Ball grid arrays, BGAs, can not be soldered by hand.
 * I have tried, and gotten close, but its not worth it. The method that almost worked was:  I leveled the board, raised above the table about 3cm.  With tweezers and care, i placed the BGA on the pads.  Then I lay the soldering iron underneath the board, no contact with the board.  And they wait.  The board heats up, and so do the solder balls on the BGA. After i was certain the solder was melted, I carefully removed the iron and let it cool.  And after all the, there was shorts.  So I never waisted my time on that again.  User:ZyMOS

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