User:ZyMOS/temp/chip carrier/Non-standard

CO chip-on, Non-packaged devices

 * COB - chip-on-board
 * COF - chip-on-flex
 * COG - chip-on-glass

PoP: Package-on-Package
Sometimes called 3D | STACKED DIE | PACKAGE-on-PACKAGE (PoP)


 * PSvfBGA: Package Stackable Very Thin Fine Pitch BGA (Amkor)


 * MCP, Stacked-Die Leadframe Packages: Multi-Chip package, Stacked-Die Leadframe Packages. This not a chip carrier but a way to stack die in a chip carrier (Amkor)


 * S-CSP: Stacked CSP