User:ZyMOS/temp/chip carrier/Ball grid array


 * SGA: Solder Grid Array
 * SHELLOP

=BGA: Ball grid array=
 * BGA: Ball grid array


 * BGA1: BGA (Intel Pentium II)


 * BGA2: BGA (Intel Pentium III)


 * CBGA: Ceramic BGA


 * CVBGA: Very Thin Chip Array BGA (Amkor)


 * CSBGA:


 * CSPBGA: Chip Scale Package BGA


 * CABGA: Chip array BGA (Amkor)

JEDEC MS-034 
 * CTBGA: ChipArray Thin Core BGA (Amkor)


 * CMBGA: ?


 * CDTBGA: Cavity Down Tape BGA


 * DBGA: Dimpled BGA


 * DSBGA: ?


 * D2BGA: Die Dimension BGA


 * ezBGA: ?


 * EBGA: Enhanced BGA


 * EDHSBGA: Exposed Drop-In Heat Sink BGA

JEDEC MO-205 
 * FBGA, FPBGA: Fine pitch BGA


 * fcLBGA: ?


 * FCBGA, FC-BGA: Flip Chip BGA


 * HBGA: Heat Spreader BGA


 * HBGA: Hybrid BGA


 * HSBGA: Heat Slug BGA


 * HPBGA: High Performance BGA

JEDEC Standard No. 75, JESD75 
 * LFBGA - low profile fine pitch BGA


 * LCBGA: Low Cost BGA


 * L2BGA: Laser Laminated BGA


 * LBGA: Laminate BGA


 * LBGA: Low-Profile BGA


 * LTBGA: Low-Profile Tape BGA


 * M2BGA


 * MCBGA: Multi-Chip BGA

JEDEC MS-034 
 * MCM-PBGA, MCM-BGA: Multi-Chip Module Plastic BGA

JEDEC MS-034 
 * MCM-CBGA, MCM-BGA: Multi-Chip Module Ceramic BGA


 * MOSFET BGA: MOSFET BGA


 * PBGA: Plastic BGA


 * PFBGA: Plastic Fine Pitch BGA 0.5mm


 * PFBGA: Plastic Fine Pitch BGA 0.8mm


 * SBGA: Spreader BGA, heatsink


 * STFBGA: Stacked Thin profile Fine pitch BGA

JEDEC MO-192 
 * SBGA: SuperBGA (Amkor)


 * TBGA: Tape BGA (ASAT, Inc.)


 * TFBGA: Thin-profile Fine-pitch BGA


 * TEPBGA: Thermally Enhanced Plastic BGA


 * TFTBGA: Thin profile Fine pitch Tape BGA

JEDEC Compliant MO-195—0.5mm, MO-216—0.8mm, MO-192—1.0mm 
 * TABGA: TapeArray BGA (.5, .8, 1.0mm Pitch) (Amkor)


 * UFBGA: Laminated Plastic BGA


 * ViperBGA


 * VBGA

JEDEC JC-11 registration - MO-225 
 * VFBGA: very-thin, fine-pitch BGA


 * μBGA, uBGA, MBGA - micro BGA


 * μFCBGA, uRCBGA: micro Flip Chip BGA


 * MICRO-ARRAY


 * ??????: Bumped Die, Flip Chip on Substrate

=MICRO SMD= 
 * Micro-SMD:


 * Thin MICRO SMD


 * MICRO SMDxt

=CSP: chip scale package= CSP: Laminated Wafer level CSP, WL: Wafer level 


 * 3DS-WLCSP: 3d Stacking Wafer-Level CSP


 * CSP^nl: True Wafer level CSP


 * CSP^nl-BOP: Bump on Pad CSP (Amkor)


 * CSP^nl-Bump on Repassivation / Redistribution (Amkor)


 * etCSP: Extremely Thin CSP (Amkor) Same as XFBGA, WFBGA ?)


 * fcCSP, FCCSP: Flip Chip CSP


 * FFCSP: flexible carrier folded real CSP


 * M2CSP: ?


 * Memory CSP


 * MCSP: ?


 * NCSP: Near CSP


 * PBCSP: Polymer Bumper CSP


 * WL-CSP, WLCSP, WCSP, Nanostar WLP: Wafer level CSP


 * UCSP: LAMINATED U CSP


 * TCSP: LAMINATED T CSP

JEDEC MO-247 
 * tsCSP: Thin substrate CSP

JEDEC MS-034 
 * LFCSP: LeadFrame CSP (Analog Devices)
 * SuperFC: Super flip chip (Amkor)


 * SCSP: Stacked CSP

FC: Flip Chip

 * FCiP: FC in Package


 * FLMP: FC in a Leaded Molded Package (Fairchild)

JEDEC MS-034 
 * SuperFC: Super FC (Amkor)

=CGA: Column Grid Array= Collumn grid array (CGA)  
 * CCGA: ceramic column grid array
 * CuCGA: Copper Column Grid Array