How to identify chip packages/old

This page contains all computer chip or integrated circuit packages. A chip package is what surrounds the integrated circuit die and connects the die's pads to the packages external pins.

=ALL packages =

Howto identify integrated circuit(IC) chip packages/All images

Ball Grid Array(BGA)
=List of IC package names=

DIL: Dual-Inline

 * DIP: Dual inline package 0.6"
 * Skinny DIP: Skinny Dual inline package 0.3"
 * CERDIP CDIP: Ceraminc Dual inline package
 * PDIP, PDIL: Plastic Dual In-Line package
 * SDIP, SHRDIL: Shrink Dual inline package
 * SPDIP: Shrink Plastic Dual In-line Package
 * Hybrid DIP: Hybrid Dual In-line Package
 * SBDIP: Side Brazed Dual In-line Package
 * SBDIP-H: Side Brazed Dual In-line Package Hybrid
 * BBDIP-H: Bottom Brazed Dual In-line Package Hybrid

SIL: Single-Inline

 * SIP: Single in-line package

PGA: Pin Grid Array

 * PGA: Pin grid array
 * PPGA: Plastic pin grid array
 * FCPGA: flip-chip pin grid array
 * CPGA: Ceramic pin grid array
 * OPGA: Organic pin grid array
 * FC-PGA: Flip Chip Pin Grid Array (Intel)
 * Micro-PGA: Micro Pin Grid Array Intel term

ZIP

 * ZIP: zig-zag in-line package
 * PZIP: plastic zig-zag in-line package

SOIC: Small Outline Integrated Circuit

 * SOIC-N-EP: Small outline integrated circuit narrow body with exposed pads with heatsink
 * batwing SOIC, SOIC-BAT: Small outline integrated circuit thermally enhanced with fused leads (batwings)
 * Mini-SOIC: Mini Small outline integrated circuit JEDEC: MO-187-AA

SO: Small Outline

 * SO-70
 * SO-73
 * SO-74A
 * SO-79
 * SO-88, SC-70 6-lead
 * SSO: Single Small Outline package
 * VSO: Very Small Outline

SOP: Small outline package

 * SOP, SO, SOIC: Small-Outline Package
 * PSOP: Plastic Small-Outline Package
 * PSOP-2: Plastic Small Outline package thermally enhanced with heatsink on top
 * PSOP-2: Plastic Small Outline package thermally enhanced with heatsink on bottom
 * PSSOP: Plastic Shrink Small-Outline Package
 * TSOP: Thin Small-Outline Package
 * TSOP I: Thin Small Outline Package type 1
 * TSOP II: Thin Small Outline Package type II
 * TSSOP: Thin Shrink Small Outline Package
 * TSSOP: Thin Shrink Small Outline Package with Exposed Pad (on bottom)
 * Wide-TSSOP: Wide Thin Shrink Small Outline Package
 * SSOP, Shrink SO: Shrink Small-Outline Package
 * QSOP: Shrink Small-Outline Package
 * QSOP-EP: Shrink Small-Outline Package
 * HSOP: Heat sinked Small-Outline Package
 * HQSOP: Hermetic Quad Small-Outline Package
 * VSOP: Very Small Outline Package
 * uSOP, uMAX: micro Small Outline Package
 * MSOP, micro-SOIC: Mini Small Outline Package
 * MSOP-EP: Mini Small Outline Package Exposed pads

SOT: Small outline transistor package
Small Outline Transistor package
 * PSOT
 * SOT-23: Small Outline Transistor package (3,5,6, or 8 Leads)
 * SOT-66: Small Outline Package
 * SOT-89: Small Outline Package
 * SOT-143: 4 Lead Small Outline Transistor Package
 * SOT-223: Small Outline Transistor Package (4 or 5 Leads)
 * TSOT-23:

SC

 * SC-101
 * SC-70: Shrink Small outline transistor

QFP: Quad Flat Package
The quad flat package (QFP) is a thin flat square or rectangular package with J-Leads on all 4 sides.
 * QFP: Quad Flat Package
 * BQFP: Bumpered Quad Flat Package
 * BQFPH: Bumpered Quad Flat Package with Heat spreader
 * CQFP: Ceramic Quad Flat Package
 * FPQFP, FQFP: Fine Pitch Quad Flat Package
 * HQFP: Heat sinked Quad Flat Package
 * LQFP: Low Profile Quad Flat Package
 * MQFP, MQUAD: Metric Quad Flat Package
 * MQFP2: Metric Quad Flat Package with heat sink
 * MQFPH: Metric Quad Flat Package with Heat spreader
 * PQFP: Plastic Quad Flat Package
 * SQFP: Small Quad Flat Package
 * TQFP: Thin Quad Flat Package
 * TSQFP: Thin Shrink Quad Flat Pack
 * VQFP: Very small Quad Flat Package
 * VTQFP: Very Thin Quad Flat Package
 * SQFP2, SQFPN: Shrink Quad Flat Package with heat sink
 * TQFP2: Thin Quad Flat Package with heat sink

QFN: Quad flat package, no-leads

 * QFN - quad flat non-leaded package
 * PQFN - power quad flat non-leaded package
 * SONQFN: Small Outline quad flat non-leaded package
 * TQFN: Thin quad flat non-leaded package
 * VQFN: very small quad flat non-leaded package
 * HVQFN:Heatsink Very-thin Quad Flat-pack No-leads
 * DR QFN:
 * DQFN: Depopulated very-thin Quad Flat-pack No-leads

SON: Small outline package, no-leads

 * SON: Small outline package, no-leads
 * PSON: Plastic Small outline package, no-leads
 * XSON, MicroPak: eXtremely thin Small Outline No leads

BGA: Ball grid array
 
 * BGA: Ball grid array
 * BGA1: Ball grid array (Intel)
 * BGA2: Ball grid array (Intel)
 * CBGA: Ceramic ball grid array
 * PBGA: Plastic ball grid array
 * FBGA, FPBGA: Fine pitch ball grid array
 * LFBGA - low profile fine pitch ball grid array JEDEC Standard No. 75, JESD75
 * μBGA - micro-ball grid array
 * HBGA Heat Spreader Ball Grid Array
 * HBGA: Hybrid Ball Grid Array
 * TFBGA: Thin-profile Fine-pitch Ball Grid Array
 * PFBGA: Plastic Fine Pitch Ball Grid Array 0.5mm
 * PFBGA: Plastic Fine Pitch Ball Grid Array 0.8mm
 * TEPBGA: Thermally Enhanced Plastic Ball Grid Array
 * EBGA: Enhanced Ball Grid Array
 * LCBGA: Low Cost Ball Grid Array
 * CSBGA:
 * VFBGA: very-thin, fine-pitch ball grid array JEDEC JC-11 registration - MO-225
 * Micro-Array
 * Micro-SMD
 * CSPBGA: Chip Scale Package Ball Grid Array
 * SBGA: Thermally Enhanced Ball Grid Array with Heatsink

Others to be sorted

 * CSP
 * CSP: Wafer level chip scale package
 * WL-CSP, WLCSP, WCSP, Nanostar: Wafer level chip scale package
 * UCSP: LAMINATED U chip scale package
 * TCSP: LAMINATED T chip scale package
 * LFCSP: LeadFrame chip scale package


 * WLP
 * WLP: Wafer level package


 * CGA
 * CCGA - ceramic column grid array
 * CGA - column grid array


 * LGA
 * LGA: land grid array
 * PLGA: Plastic land grid array
 * CLGA: Ceramic land grid array
 * PILGA:
 * CSLGA:


 * SOJ
 * SOJ: small outline J-lead
 * HSOJ: Heat sinked small outline J-lead
 * PSOJ: plastic small outline J-lead


 * LCC, QFJ
 * LCC, QFJ - Leadless Chip Carrier
 * PLCC, PQFJ, : plastic leaded chip carrier
 * CLCC, CQFJ, LCCC: ceramic leaded chip carrier


 * TO
 * TO-3
 * TO-5 Plastic Header Package with flat index thru-hole
 * TO-8: Metal Header Package thru-hole
 * TO-46
 * TO-51: Metal Header Package thru-hole
 * TO-51: Metal Header Package thru-hole
 * TO-52: Metal Header Package thru-hole [http://pdfserv.maxim-ic.com/package_dwgs/21-0019.PDF
 * TO-78: Metal Header Package thru-hole
 * TO-92 Plastic Header Package with flat index thru-hole
 * TO-99: Metal Header Package thru-hole
 * TO-100: Metal Header Package thru-hole
 * TO-126
 * TO-218
 * TO-220
 * TO-220AB, SC-46
 * TO-220F
 * TO-243, SC-62
 * TO-247
 * TO-251
 * TO-252, SC-63, DPAK
 * TO-262
 * TO-263 thin
 * TO-263, D2PAK
 * TO-264
 * TO-268, D3PAK


 * CO chip-on, Non-packaged devices
 * COB - chip-on-board
 * COF - chip-on-flex
 * COG - chip-on-glass


 * PAK
 * DPAK: Deca-Watt Package (Hitachi) transistor
 * HDPAK: Huge Deca-watt PAcKage (Hitachi) transistor
 * LDPAK: Large Deca-watt PAcKage (Hitachi) diode
 * MPAK: Mini PAcKage (Hitachi) transistor
 * SMPAK: Super Mini Package (Hitachi) transistor
 * SPAK: Small PAcKage (Hitachi) transistor
 * UPAK: Uni-Watt Package (Hitachi) diode
 * LFPAK


 * MLP
 * MLP: Micro Lead Frame Package
 * MLF: MicroLeadFrame (Amkor)
 * MLFQ: Micro Lead Frame Quad Package (Quad)
 * MLFD: Micro Lead Frame Package (Dual)


 * SP: Single in line Package (Hitachi) transistor
 * SRP: Small Resin Package (Hitachi) diode
 * SSP: Super Small resin Package (Hitachi) diode
 * UMD: Ultra Mini Diode (Hitachi) transistor
 * URP: Ultra small Resin Package (Hitachi) transistor


 * TAB: Tape Automated Bonding
 * MELF: Metal ELectrical Face
 * MLP - Leadframe package
 * TCCN:


 * CASON: Chip Array Small Outline No Lead
 * CERQUAD: CERamic QUAD in-line package
 * CMPAK: Compact Mini PAcKage Hitachi diode/transistor
 * CerPack: CERamic flatPACK
 * SOD - Small outline diode


 * SOG: Small Outline IC with Gull-wing leads
 * DSO: Dual Small Outline package
 * EQUAD
 * FC: Flip Chip


 * I-leaded package
 * QFI: Quad Flat I-leaded package
 * HQFI: Heat sinked Quad Flat I-leaded package
 * SOI: Small Outline I-leaded package
 * HSOI: Heat sinked Small Outline I-leaded package


 * LLD: LeadLess Diode (Hitachi)
 * QFJ: quad flat J-lead
 * LRP: Large Resin Package (Hitachi) diode


 * MOP: Mini Oct-Lead Package (Hitachi) transistor
 * PLCCH: Plastic Leaded Chip Carrier with Heat spreader
 * PQ2: Power Quad flat package type 2


 * QIL, QIP,QUIP, QUAD, QUIL: Quad In-line Package
 * QTCP: Quad Tape Carrier Package
 * SD: Side-brazed ceramic Dual in-line package
 * SECC: Single Edge Cartridge Connector (Intel)
 * SGA: Solder Grid Array


 * MELF: Metal ELectrical Face
 * MLP - Leadframe package
 * TD: Top-brazed ceramic Dual in-line package
 * CerQUAD: Ceramic quad package
 * DFP: Dual Flat Package
 * SONB: Small Outline Narrow-Body IC with gull-wing leads


 * LLDA
 * PMFP


 * LCC: Leadless Chip Carrier or Leadless Ceramic Carrier
 * LCCC: Leadless Ceramic Chip Carrier


 * QCCN
 * LLP


 * SHELLOP
 * MicroDFN, uDFN:
 * Ultra Thin MicroDFN:
 * SideBraze
 * WLP: WAFER LEVEL PACKAGE
 * BCC:
 * LPCC:
 * MFL:
 * PoP: Package-on-Package


 * FLATPACK: Ceramic Flat Package