This page contains all computer chip or integrated circuit packages. A chip package is what surrounds the integrated circuit die and connects the die's pads to the packages external pins.
ALL packages[]
Howto identify integrated circuit(IC) chip packages/All images
Image | Abbrv | Full Name | JEDEC/JEITA |
---|---|---|---|
BQFP | Bumpered Quad Flat Package | ||
BQFPH | Bumpered Quad Flat Package with Heat spreader | ||
CASON | Chip Array Small Outline No Lead | ||
CERQUAD | CERamic QUAD in-line package | ||
CLCC, CCC | Ceramic Leadless Chip Carrier, Ceramic Chip Carrier | ||
CMPAK | Compact Mini PAcKage Hitachi diode/transistor | ||
CerPack | CERamic flatPACK | ||
DPAK | Deca-Watt Package Hitachi transistor | ||
DSO | Dual Small Outline package | ||
EQUAD | |||
FC | Flip Chip | ||
FC-PGA | Flip Chip Pin Grid Array Intel term | ||
FPQFP, FQFP | Fine Pitch Quad Flat Package | ||
HDPAK | Huge Deca-watt PAcKage Hitachi transistor | ||
HQFI | Heat sinked QFI | ||
HQFP | Heat sinked QFP | ||
HSOI | Heat sinked SOI | ||
HSOJ | Heat sinked SOJ | ||
LDPAK | Large Deca-watt PAcKage Hitachi diode | ||
LGA | Land Grid Array | ||
LLD | LeadLess Diode Hitachi diode | ||
LQFP | Low profile QFP | ||
LRP | Large Resin Package Hitachi diode | ||
MLF | Micro Lead Frame (Amkor) | ||
MOP | Mini Oct-Lead Package Hitachi transistor | ||
MPAK | Mini PAcKage Hitachi transistor | ||
OLGA | Organic Land Grid Array (Intel term) which uses Controlled Collapse Chip Connection (C4) | ||
PILGA | ED-7311-18 | ||
PLCC, PQFJ | Plastic Leaded Chip Carrier (20,28,32,44,52,68,84). | ||
PLCCH | Plastic Leaded Chip Carrier with Heat spreader | ||
PLGA | Plastic Land Grid Array Intel term | ||
PPGA | Plastic Pin Grid Array. | ||
PQ2 | Power Quad flat package type 2 | ||
PSOJ | |||
PZIP | ED-7311-17 | ||
QFI | Quad Flat I-leaded package | ||
QFJ | Quad Flat J-leaded package | ||
QFN | Quad Flat Non-leaded package (big heat conducting pad in the bottom) | ||
QIL | Quad In-Line package | ||
QIP | Quad In-line Package | ||
QTCP | Quad Tape Carrier Package | ||
QUAD | QUAD in-line package | ||
QUIL | QUad In-Line package | ||
QUIP | QUad In-line Package | ||
SD | Side-brazed ceramic Dual in-line package | ||
SECC | Single Edge Cartridge Connector Intel term | ||
SGA | Solder Grid Array | ||
SHRDIL | SHRink Dual In-Line (20,24,32,42,52,64) | ||
SIL | Single In-Line (9,13,17) | ||
SMPAK | Super Mini Package Hitachi transistor | ||
SO-70 | |||
SOD | Small Outline Diode | ||
SOG | Small Outline IC with Gull-wing leads | ||
SOI | Small Outline I-leaded package | ||
SONQFN | Small Outline Non-Leaded Package | ||
SOP | Small Outline Package. | ||
SP-10 | Single in line Package 10 pin Hitachi transistor | ||
SP-12 | Single in line Package 12 pin Hitachi diode | ||
SPAK | Small PAcKage Hitachi transistor | ||
SRP | Small Resin Package Hitachi diode | ||
SSO | Single Small Outline package | ||
SSP | Super Small resin Package Hitachi diode | ||
TAB | Tape Automated Bonding | ||
TCCN | Unknown | ||
TD | Top-brazed ceramic Dual in-line package | ||
TO-218 | Unknown | ||
TO-251 | Unknown | ||
TO-252, SC-63 | Unknown | ||
TO-263 thin | Unknown | ||
TO-263 | Unknown | ||
TO-243, SC-62 | Unknown | ||
TQFN | Thin Quad Flat Package with No-Lead | ||
UMD | Ultra Mini Diode Hitachi transistor | ||
UPAK | Uni-Watt Package Hitachi diode | ||
URP | Ultra small Resin Package Hitachi transistor | ||
VQFN | Very small Quad Flat No pins | ||
VSO | Very Small Outline (40,56) |
Through Hole[]
Chip[]
Image | Abbrv | Full Name | JEDEC/JEITA | ||
---|---|---|---|---|---|
SIP | Single In-line Package | ||||
SDIP | Shrink Dual In-line Package | ||||
DIP | Dual In-line Package. | ||||
Micro-PGA | Micro Pin Grid Array Intel term | ||||
CDIP | Ceramic Dual In-line Package. | ||||
PGA | Pin Grid Array. | ED-7311-23 | |||
ZIP | Zigzag In-line Package | ||||
PDIL | Plastic Dual In-Line package | ||||
PDIP | Plastic Dual In-Line Package. | ||||
CerDIP | CERamic Dual In-line Package. | ||||
DIL | Dual In-Line (8,14,16,18,20,22,24,28,32,40,48) | ||||
CerQUAD | Ceramic quad package | ||||
CPGA | Ceramic pin grid array, w/ heat spreader | ||||
CPGA | Ceramic pin grid array |
Other[]
Image | Abbrv | Full Name | JEDEC/JEITA |
---|---|---|---|
TO-126 | Unknown | ||
TO-220 | Unknown | ||
TO-247 | Unknown | ||
TO-262 | Unknown | ||
TO-264 | Unknown | ||
TO-92 | Unknown | ||
TO-220 | Unknown | ||
TO-220AB, SC-46 | Unknown | ||
TO-220F | Unknown | ||
TO-3 | Unknown | ||
TO-46 | Unknown | ||
TO-5 | Unknown |
Surface Mount[]
Leads[]
Image | Abbrv | Full Name | JEDEC/JEITA |
---|---|---|---|
DFP | Dual Flat Package | ||
PQFP | Plastic Quad Flat Package | ED-7311A | |
QFP | Quad Flat Package (44S10,44S14,48S10,64REC,80REC,100REC,120,128,160) | ||
QSOP | Quarter Size Outline Package (16,20,24,28) or Quality Small Outline Package | ||
SOIC, SO | Small Outline Integrated Circuit (same as SO) | ||
SOIC (wide) | Small Outline Integrated Circuit (wide) | ||
SOIC (narrow) | Small Outline Integrated Circuit (narrow) | ||
SOJ | Small Outline J-leaded package | ||
SONB | Small Outline Narrow-Body IC with gull-wing leads | ||
SOT-23 | Small Outline Transistor. | ||
SQFP | Shrink Quad Flat Pack (32,48,64,80,208,240) | ||
SQFP2 | Shrink Quad Flat Package with heat sink | ||
SQFPH | Shrink Quad Flat Package with Heat spreader | ||
SSOP | Small Shrink Outline Package (20,24,28,48,56). | ||
TQFP | Thin Quad Flat Package | ||
TQFP2 | Thin Quad Flat Package with heat sink | ||
PSON | ED-7311-19 | ||
PSOP | Plastic Small Outline package | ED-7311-19 | |
PSOP-2 | Plastic Small Outline package | ||
PSSOP | ED-7311-20 | ||
PHSOP | ED-7311-21 | ||
MQFP | Metric Quad Flat Package | ||
HSOP | Heat sinked SOP | ||
HQSOP | Hermetic QSOP (20,24) | ||
MQFP2 | Metric Quad Flat Package with heat sink | ||
MQFPH | Metric Quad Flat Package with Heat spreader | ||
MQUAD | Metric QUAD flat package | ||
TSOP 1 | Thin Small Outline Package type 1 | ED-7311-1 | |
TSOPII | Thin Small Outline Package type II | ED-7311-2 | |
TSQFP | Thin Shrink Quad Flat Pack (44,64,100) | ||
TSSOP | Thin Shrink Small Outline Package (20,24,28,48,56). | ||
VQFP | Very small Quad Flat Package | ||
VSOP | Very Small Outline Package | ||
VTQFP | Very Thin Quad Flat Package | ||
VTSOP | Very Thin Small Outline Package. | ||
LFPAK | |||
LLDS | |||
Mini SOIC | |||
PMFP | |||
PSOT | |||
SO-70 | |||
SO-73 | |||
SO-74A | |||
SO-79 | |||
SO-88, SC-70 6 |
Leadless[]
Image | Abbrv | Full Name | JEDEC/JEITA |
---|---|---|---|
LCC | Leadless Chip Carrier or Leadless Ceramic Carrier | ||
QCCN | |||
SC-101 | |||
LLP | |||
CSP | Laminated Chip Scale Package. | ||
LCCC | Leadless Ceramic Chip Carrier | ||
UCSP | LAMINATED U chip scale package | ||
TCSP | LAMINATED T chip scale package | ||
HVQFN |
Ball Grid Array(BGA)[]
Image | Abbrv | Full Name | JEDEC/JEITA |
---|---|---|---|
TFBGA | Thin-profile Fine-pitch Ball Grid Array | ||
HBGA | |||
SHELLOP | |||
FBGA,FPBGA | Fine Pitch Ball Grid Array. | ||
CBGA | Ceramic Ball Grid Array. | ||
µBGA | Micro Ball Grid Array. | ||
PFBGA | Plastic Fine Pitch Ball Grid Array 0.5mm | ED-7311-7 | |
PFBGA | Plastic Fine Pitch Ball Grid Array 0.8mm | ED-7311-8 | |
FBGA,FPBGA | Fine Pitch Ball Grid Array. | ||
TEPBGA | Thermally Enhanced Plastic Ball Grid Array | ||
LFBGA | Leadless Fine Pitch Ball Grid Array | ||
EBGA | Enhanced Ball Grid Array | ||
PBGA | Plastic Ball Grid Array. | ||
LCBGA | Low Cost Ball Grid Array. | ||
Micro-Array | Micro array | ||
Micro-SMD | Micro surface mount device |
List of IC package names[]
Through-hole[]
DIL: Dual-Inline[]
- DIP: Dual inline package 0.6" [1]
- Skinny DIP: Skinny Dual inline package 0.3" [2]
- CERDIP CDIP: Ceraminc Dual inline package [3]
- PDIP, PDIL: Plastic Dual In-Line package
- SDIP, SHRDIL: Shrink Dual inline package
- SPDIP: Shrink Plastic Dual In-line Package
- Hybrid DIP: Hybrid Dual In-line Package
- SBDIP: Side Brazed Dual In-line Package
- SBDIP-H: Side Brazed Dual In-line Package Hybrid [5]
- BBDIP-H: Bottom Brazed Dual In-line Package Hybrid [6]
SIL: Single-Inline[]
- SIP: Single in-line package
PGA: Pin Grid Array[]
- PGA: Pin grid array
- PPGA: Plastic pin grid array
- FCPGA: flip-chip pin grid array
- CPGA: Ceramic pin grid array
- OPGA: Organic pin grid array
- FC-PGA: Flip Chip Pin Grid Array (Intel)
- Micro-PGA: Micro Pin Grid Array Intel term
ZIP[]
- ZIP: zig-zag in-line package
- PZIP: plastic zig-zag in-line package
Surface Mount[]
J-Lead[]
DIL: Dual Inline[]
SOIC: Small Outline Integrated Circuit[]
- SOIC-N-EP: Small outline integrated circuit narrow body with exposed pads with heatsink [7]
- batwing SOIC, SOIC-BAT: Small outline integrated circuit thermally enhanced with fused leads (batwings) [8]
- Mini-SOIC: Mini Small outline integrated circuit JEDEC: MO-187-AA [9]
SO: Small Outline[]
- SO-70
- SO-73
- SO-74A
- SO-79
- SO-88, SC-70 6-lead [10]
- SSO: Single Small Outline package
- VSO: Very Small Outline
SOP: Small outline package[]
- SOP, SO, SOIC: Small-Outline Package
- PSOP: Plastic Small-Outline Package
- PSOP-2: Plastic Small Outline package thermally enhanced with heatsink on top [11]
- PSOP-2: Plastic Small Outline package thermally enhanced with heatsink on bottom [12]
- PSSOP: Plastic Shrink Small-Outline Package
- TSOP: Thin Small-Outline Package
- TSOP I: Thin Small Outline Package type 1
- TSOP II: Thin Small Outline Package type II
- TSSOP: Thin Shrink Small Outline Package [13]
- TSSOP: Thin Shrink Small Outline Package with Exposed Pad (on bottom) [14]
- Wide-TSSOP: Wide Thin Shrink Small Outline Package [15]
- SSOP, Shrink SO: Shrink Small-Outline Package [16]
- QSOP: Shrink Small-Outline Package [17]
- QSOP-EP: Shrink Small-Outline Package [18]
- HSOP: Heat sinked Small-Outline Package
- HQSOP: Hermetic Quad Small-Outline Package
- VSOP: Very Small Outline Package
- uSOP, uMAX: micro Small Outline Package
- MSOP, micro-SOIC: Mini Small Outline Package [19]
- MSOP-EP: Mini Small Outline Package Exposed pads [20]
SOT: Small outline transistor package[]
Small Outline Transistor package
- PSOT
- SOT-23: Small Outline Transistor package (3,5,6, or 8 Leads) [21]
- SOT-66: Small Outline Package [22]
- SOT-89: Small Outline Package
- SOT-143: 4 Lead Small Outline Transistor Package [23]
- SOT-223: Small Outline Transistor Package (4 or 5 Leads) [24]
- TSOT-23: [25]
SC[]
- SC-101
- SC-70: Shrink Small outline transistor [26]
QIL: Quad Inline[]
QFP: Quad Flat Package[]
The quad flat package (QFP) is a thin flat square or rectangular package with J-Leads on all 4 sides.
- QFP: Quad Flat Package
- BQFP: Bumpered Quad Flat Package
- BQFPH: Bumpered Quad Flat Package with Heat spreader
- CQFP: Ceramic Quad Flat Package
- FPQFP, FQFP: Fine Pitch Quad Flat Package
- HQFP: Heat sinked Quad Flat Package
- LQFP: Low Profile Quad Flat Package
- MQFP, MQUAD: Metric Quad Flat Package [27]
- MQFP2: Metric Quad Flat Package with heat sink
- MQFPH: Metric Quad Flat Package with Heat spreader
- PQFP: Plastic Quad Flat Package
- SQFP: Small Quad Flat Package
- TQFP: Thin Quad Flat Package [28]
- TSQFP: Thin Shrink Quad Flat Pack
- VQFP: Very small Quad Flat Package
- VTQFP: Very Thin Quad Flat Package
- SQFP2, SQFPN: Shrink Quad Flat Package with heat sink
- TQFP2: Thin Quad Flat Package with heat sink
Leadless[]
QFN: Quad flat package, no-leads[]
- QFN - quad flat non-leaded package [29]
- PQFN - power quad flat non-leaded package
- SONQFN: Small Outline quad flat non-leaded package
- TQFN: Thin quad flat non-leaded package
- VQFN: very small quad flat non-leaded package
- HVQFN:Heatsink Very-thin Quad Flat-pack No-leads [30]
- DR QFN:
- DQFN: Depopulated very-thin Quad Flat-pack No-leads [31]
SON: Small outline package, no-leads[]
- SON: Small outline package, no-leads
- PSON: Plastic Small outline package, no-leads
- XSON, MicroPak: eXtremely thin Small Outline No leads [32]
BGA: Ball grid array[]
- BGA: Ball grid array
- BGA1: Ball grid array (Intel)
- BGA2: Ball grid array (Intel)
- CBGA: Ceramic ball grid array [33]
- PBGA: Plastic ball grid array
- FBGA, FPBGA: Fine pitch ball grid array
- LFBGA - low profile fine pitch ball grid array JEDEC Standard No. 75, JESD75 [34]
- μBGA - micro-ball grid array
- HBGA Heat Spreader Ball Grid Array
- HBGA: Hybrid Ball Grid Array [36]
- TFBGA: Thin-profile Fine-pitch Ball Grid Array
- PFBGA: Plastic Fine Pitch Ball Grid Array 0.5mm
- PFBGA: Plastic Fine Pitch Ball Grid Array 0.8mm
- TEPBGA: Thermally Enhanced Plastic Ball Grid Array
- EBGA: Enhanced Ball Grid Array
- LCBGA: Low Cost Ball Grid Array
- CSBGA: [37]
- VFBGA: very-thin, fine-pitch ball grid array JEDEC JC-11 registration - MO-225 [38]
- Micro-Array
- Micro-SMD
- CSPBGA: Chip Scale Package Ball Grid Array [40]
- SBGA: Thermally Enhanced Ball Grid Array with Heatsink [41]
Others to be sorted[]
- CSP
- CSP: Wafer level chip scale package
- WL-CSP, WLCSP, WCSP, Nanostar: Wafer level chip scale package
- UCSP: LAMINATED U chip scale package [42]
- TCSP: LAMINATED T chip scale package
- LFCSP: LeadFrame chip scale package
- WLP
- WLP: Wafer level package
- CGA
- CCGA - ceramic column grid array
- CGA - column grid array
- LGA
- LGA: land grid array
- PLGA: Plastic land grid array
- CLGA: Ceramic land grid array
- PILGA:
- CSLGA: [43]
- SOJ
- SOJ: small outline J-lead
- HSOJ: Heat sinked small outline J-lead
- PSOJ: plastic small outline J-lead
- LCC, QFJ
- LCC, QFJ - Leadless Chip Carrier [44]
- PLCC, PQFJ, : plastic leaded chip carrier [45]
- CLCC, CQFJ, LCCC: ceramic leaded chip carrier
- TO
- TO-3
- TO-5 Plastic Header Package with flat index thru-hole [46]
- TO-8: Metal Header Package thru-hole [47]
- TO-46
- TO-51: Metal Header Package thru-hole [48]
- TO-51: Metal Header Package thru-hole
- TO-52: Metal Header Package thru-hole [49] [http://pdfserv.maxim-ic.com/package_dwgs/21-0019.PDF
- TO-78: Metal Header Package thru-hole [50]
- TO-92 Plastic Header Package with flat index thru-hole [51]
- TO-99: Metal Header Package thru-hole [52]
- TO-100: Metal Header Package thru-hole [53]
- TO-126
- TO-218
- TO-220
- TO-220AB, SC-46
- TO-220F
- TO-243, SC-62
- TO-247
- TO-251
- TO-252, SC-63, DPAK
- TO-262
- TO-263 thin
- TO-263, D2PAK
- TO-264
- TO-268, D3PAK
- CO chip-on, Non-packaged devices
- COB - chip-on-board
- COF - chip-on-flex
- COG - chip-on-glass
- PAK
- DPAK: Deca-Watt Package (Hitachi) transistor
- HDPAK: Huge Deca-watt PAcKage (Hitachi) transistor
- LDPAK: Large Deca-watt PAcKage (Hitachi) diode
- MPAK: Mini PAcKage (Hitachi) transistor
- SMPAK: Super Mini Package (Hitachi) transistor
- SPAK: Small PAcKage (Hitachi) transistor
- UPAK: Uni-Watt Package (Hitachi) diode
- LFPAK
- MLP
- MLP: Micro Lead Frame Package
- MLF: MicroLeadFrame (Amkor)
- MLFQ: Micro Lead Frame Quad Package (Quad)
- MLFD: Micro Lead Frame Package (Dual)
- SP: Single in line Package (Hitachi) transistor
- SRP: Small Resin Package (Hitachi) diode
- SSP: Super Small resin Package (Hitachi) diode
- UMD: Ultra Mini Diode (Hitachi) transistor
- URP: Ultra small Resin Package (Hitachi) transistor
- TAB: Tape Automated Bonding
- MELF: Metal ELectrical Face
- MLP - Leadframe package
- TCCN:
- CASON: Chip Array Small Outline No Lead
- CERQUAD: CERamic QUAD in-line package
- CMPAK: Compact Mini PAcKage Hitachi diode/transistor
- CerPack: CERamic flatPACK
- SOD - Small outline diode
- SOG: Small Outline IC with Gull-wing leads
- DSO: Dual Small Outline package
- EQUAD
- FC: Flip Chip
- I-leaded package
- QFI: Quad Flat I-leaded package
- HQFI: Heat sinked Quad Flat I-leaded package
- SOI: Small Outline I-leaded package
- HSOI: Heat sinked Small Outline I-leaded package
- LLD: LeadLess Diode (Hitachi)
- QFJ: quad flat J-lead
- LRP: Large Resin Package (Hitachi) diode
- MOP: Mini Oct-Lead Package (Hitachi) transistor
- PLCCH: Plastic Leaded Chip Carrier with Heat spreader
- PQ2: Power Quad flat package type 2
- QIL, QIP,QUIP, QUAD, QUIL: Quad In-line Package
- QTCP: Quad Tape Carrier Package
- SD: Side-brazed ceramic Dual in-line package
- SECC: Single Edge Cartridge Connector (Intel)
- SGA: Solder Grid Array
- MELF: Metal ELectrical Face
- MLP - Leadframe package
- TD: Top-brazed ceramic Dual in-line package
- CerQUAD: Ceramic quad package
- DFP: Dual Flat Package
- SONB: Small Outline Narrow-Body IC with gull-wing leads
- LLDA
- PMFP
- LCC: Leadless Chip Carrier or Leadless Ceramic Carrier
- LCCC: Leadless Ceramic Chip Carrier
- QCCN
- LLP
- SHELLOP
- MicroDFN, uDFN: [54]
- Ultra Thin MicroDFN: [55]
- SideBraze [56]
- WLP: WAFER LEVEL PACKAGE
- BCC:
- LPCC:
- MFL:
- PoP: Package-on-Package