• SGA: Solder Grid Array


BGA: Ball grid array[edit | edit source]

  • BGA: Ball grid array



Image Abbrv Full Name JEDEC/JEITA
Upload image of chip package BGA1 BGA (Intel Pentium II)
Upload image of chip package BGA2: BGA (Intel Pentium III)
Upload image of chip package CBGA Ceramic BGA [1]
Upload image of chip package CVBGA Very Thin Chip Array BGA (Amkor)

[2]

Upload image of chip package CSBGA ? [3]
Upload image of chip package CSPBGA Chip Scale Package BGA

[4]

Upload image of chip package CABGA Chip array BGA (Amkor)

[5]

Upload image of chip package CTBGA ChipArray Thin Core BGA (Amkor)

JEDEC MS-034 [6]

Upload image of chip package CMBGA, CmBGA Ceramic mini BGA
Upload image of chip package CDTBGA Cavity Down Tape BGA [7]


Upload image of chip package DBGA Dimpled BGA [8]
Upload image of chip package DSBGA Die size BGA [9]
Upload image of chip package D2BGA Die Dimension BGA (NEC) [10]
Upload image of chip package ezBGA ?


515 lead EBGA (thermally) Enhanced BGA [11]
Upload image of chip package EDHSBGA Exposed Drop-In Heat Sink BGA [12]
192 lead FBGA, FPBGA Fine pitch BGA JEDEC MO-205

[13]

Upload image of chip package fcLBGA Flip chip low profile BGA
Upload image of chip package SG-FCLBGA Silicon green flip chip low profile BGA [14]
256 lead FCBGA, FC-BGA Flip Chip BGA
256 lead HP-fcBGA, High performance flip Chip BGA [15]
256 lead XP-fcBGA Extra performance flip Chip BGA [16]
456 lead HBGA Heat Spreader BGA
Upload image of chip package HBGA High power BGA

[17]

Upload image of chip package HBGA Hybrid fine line flip chip BGA

[18]

Upload image of chip package HSBGA Heat Slug/spreader/sink BGA
Upload image of chip package HPBGA High Performance BGA

[19]


Upload image of chip package LFBGA Low profile fine pitch BGA

JEDEC Standard No. 75, JESD75 [20] [21]

Upload image of chip package LCBGA Low Cost BGA
Upload image of chip package L2BGA Laser Laminated BGA
Upload image of chip package LBGA Laminate BGA
Upload image of chip package LBGA Low-Profile BGA [22]
Upload image of chip package LTBGA Low-Profile Tape BGA
Upload image of chip package MBGA Metal substraight BGA
Upload image of chip package M2BGA Mitsui mini BGA
Upload image of chip package MCBGA Multi-Chip BGA [23]
Upload image of chip package MCM-PBGA, MCM-BGA Multi-Chip Module Plastic BGA JEDEC MS-034

[24]

Upload image of chip package MCM-CBGA, MCM-BGA Multi-Chip Module Ceramic BGA JEDEC MS-034

[25]

Upload image of chip package MOSFET BGA MOSFET BGA [26]
156 lead PBGA Plastic BGA

[27]

Upload image of chip package PFBGA Plastic Fine Pitch BGA [28]
Upload image of chip package SBGA Spreader BGA, heatsink [29]
Upload image of chip package STFBGA Stacked Thin profile Fine pitch BGA [30]
Upload image of chip package SBGA SuperBGA (Amkor)

JEDEC MO-192 [31]

Upload image of chip package TBGA Tape BGA [32]
128 lead TFBGA Thin-profile Fine-pitch BGA [33]
324 lead TEPBGA Thermally Enhanced Plastic BGA [34]
Upload image of chip package TFTBGA Thin profile Fine pitch Tape BGA [35]
Upload image of chip package TABGA TapeArray BGA (.5, .8, 1.0mm Pitch) (Amkor)

JEDEC Compliant MO-195—0.5mm, MO-216—0.8mm, MO-192—1.0mm [36]

100 lead UFBGA Laminated Plastic BGA?

[37]

Upload image of chip package ViperBGA (ProLinx) [38]
Upload image of chip package VBGA Very Thin Profile Ball-Grid-Array
Upload image of chip package VFBGA very thin profile, fine pitch BGA

JEDEC JC-11 registration - MO-225 [39] [40]

Upload image of chip package μBGA, uBGA, MBGA micro BGA
Upload image of chip package UBGA Ultra thin BGA
Upload image of chip package μFCBGA, uFCBGA micro Flip Chip BGA Pentium 4
Upload image of chip package ?????? Bumped Die, Flip Chip on Substrate

[41]

MICRO SMD[edit | edit source]

Image Abbrv Full Name JEDEC/JEITA
20 lead Micro-SMD ?

[42]

14 lead Micro-SMD-A ?
Upload image of chip package Thin MICRO SMD ?

[43]

Upload image of chip package MICRO SMDxt ?

[44]

81 lead MICRO-ARRAY ?

[45]



CSP: chip scale package[edit | edit source]

16 lead CSP, bottom view

CSP: Laminated Wafer level CSP, WL: Wafer level [46]

Image Abbrv Full Name JEDEC/JEITA
Upload image of chip package 3DS-WLCSP 3d Stacking Wafer-Level CSP
Upload image of chip package CSP^nl True Wafer level CSP

[47]

Upload image of chip package CSP^nl-BOP Bump on Pad CSP (Amkor)

[48]

Upload image of chip package CSP^nl-Bump on Repassivation / Redistribution (Amkor)

[49]

Upload image of chip package etCSP Extremely Thin CSP (Amkor) Same as XFBGA, WFBGA ?)

[50]

Upload image of chip package fcCSP, FCCSP Flip Chip CSP

[51]

Upload image of chip package FFCSP flexible carrier folded real CSP
Upload image of chip package M2CSP ?
Upload image of chip package Memory CSP ?
Upload image of chip package MCSP ?
Upload image of chip package NCSP Near CSP
Upload image of chip package PBCSP Polymer Bumper CSP
Upload image of chip package WL-CSP, WLCSP, WCSP, Nanostar WLP Wafer level CSP
20 lead UCSP LAMINATED U CSP [52]

[53]

Upload image of chip package TCSP LAMINATED T CSP

[54]

Upload image of chip package tsCSP Thin substrate CSP

JEDEC MO-247 [55]

Upload image of chip package LFCSP LeadFrame CSP (Analog Devices)
Upload image of chip package SuperFC Super flip chip (Amkor)

JEDEC MS-034 [56]

Upload image of chip package SCSP Stacked CSP

FC: Flip Chip[edit | edit source]

Image Abbrv Full Name JEDEC/JEITA
Upload image of chip package FCiP FC in Package
Upload image of chip package FLMP FC in a Leaded Molded Package (Fairchild)
Upload image of chip package SuperFC Super FC (Amkor)

JEDEC MS-034 [57]

CGA: Column Grid Array[edit | edit source]

Collumn grid array (CGA)


Image Abbrv Full Name JEDEC/JEITA
Upload image of chip package CCGA ceramic column grid array

[58]

Upload image of chip package CuCGA Copper Column Grid Array

[59]


Other[edit | edit source]

Image Abbrv Full Name JEDEC/JEITA
36 lead SHELLOP ?
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