How to identify chip packages/Unsorted

Rectifier

Image	Abbrv	Full Name	JEDEC/JEITA
	GBPC	rectifier	[1]
	GBPC-W	rectifier	[2]
	GBU	rectifier	[3]
	GBL	rectifier	[4]
	KBPM	rectifier	[5]
	KBU		[6]
	KBL		[7]
	Reflective Arrowhead		[8]
	Reflective Arrowhead, Wires		[9]

PAK

PAK, PAKage

• DPAK: Deca-Watt Package (Hitachi) transistor
• HDPAK: Huge Deca-watt PAcKage (Hitachi) transistor
• LDPAK: Large Deca-watt PAcKage (Hitachi) diode
• MPAK: Mini PAcKage (Hitachi) transistor
• SMPAK: Super Mini Package (Hitachi) transistor
• SPAK: Small PAcKage (Hitachi) transistor
• UPAK: Uni-Watt Package (Hitachi) diode
• LFPAK: Loss Free Package
• CMPAK: Compact Mini PAcKage Hitachi diode/transistor

• RFPAK-F Radio frequency Package G

• RFPAK-G Radio frequency Package G

OTHERS

• RP8P Radio frequency 8pin Plastic
• RF-Or
• RF-Q

• 24PM-AA

[10]

• 25PM-AA

[11]

• SP: Single in line Package (Hitachi) transistor
• SRP: Small Resin Package (Hitachi) diode
• SSP: Super Small resin Package (Hitachi) diode
• UMD: Ultra Mini Diode (Hitachi) transistor
• URP: Ultra small Resin Package (Hitachi) transistor

• UFP Ultra Small Flat Package
• SFP Super Small Flat Package
• EFP Extramly Small Flat Package

• MELF: Metal ELectrical Face
• MLP - Leadframe package

• TCCN:

• PMFP

• SVP surface vertical package

• LLD: LeadLess Diode (Hitachi)

• LRP: Large Resin Package (Hitachi) diode

• MOP: Mini Oct-Lead Package (Hitachi) transistor

• QTCP: Quad Tape Carrier Package

• SECC: Single Edge Cartridge Connector (Intel)

• MELF: Metal ELectrical Face
• MLP - Leadframe package

• DFP: Dual Flat Package

• LLDA

• QCCN

• BCC:
• LPCC:
• MFL:

• CMCM: Ceramic Multi-Chip Module Package

• 7PM-HA

[12]

• 7PM-IA

[13]

• 7PM-GA

[14]

• BOC,
• CCD II
• CCD III
• DIC
• DLP
• Flip Stack
• LDCC
• LTCC
• Micro EMS
• TAPP™
• Wafer Backgrind
• Wafer Saw