This page contains all computer chip or integrated circuit packages. A chip package is what surrounds the integrated circuit die and connects the die's pads to the packages external pins.

ALL packages[edit | edit source]

Howto identify integrated circuit(IC) chip packages/All images


Image Abbrv Full Name JEDEC/JEITA
PQFP 132L.gif
BQFP Bumpered Quad Flat Package

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BQFPH Bumpered Quad Flat Package with Heat spreader

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CASON Chip Array Small Outline No Lead

24 lead CERQUAD

CERQUAD CERamic QUAD in-line package

68L CLCC

CLCC, CCC Ceramic Leadless Chip Carrier, Ceramic Chip Carrier

4L CMPAK

CMPAK Compact Mini PAcKage Hitachi diode/transistor

14L CERPACK

CerPack CERamic flatPACK

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DPAK Deca-Watt Package Hitachi transistor

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DSO Dual Small Outline package

EQUAD_32L.gif

EQUAD

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FC Flip Chip

FCBGA_256L.gif

FC-PGA Flip Chip Pin Grid Array Intel term

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FPQFP, FQFP Fine Pitch Quad Flat Package

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HDPAK Huge Deca-watt PAcKage Hitachi transistor

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HQFI Heat sinked QFI

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HQFP Heat sinked QFP

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HSOI Heat sinked SOI

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HSOJ Heat sinked SOJ

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LDPAK Large Deca-watt PAcKage Hitachi diode

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LGA Land Grid Array

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LLD LeadLess Diode Hitachi diode

LQFP_48L.gif

LQFP Low profile QFP

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LRP Large Resin Package Hitachi diode

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MLF Micro Lead Frame (Amkor)

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MOP Mini Oct-Lead Package Hitachi transistor

4L MPAK

MPAK Mini PAcKage Hitachi transistor

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OLGA Organic Land Grid Array (Intel term) which uses Controlled Collapse Chip Connection (C4)

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PILGA ED-7311-18

PLCC_32L.gif

PLCC, PQFJ Plastic Leaded Chip Carrier (20,28,32,44,52,68,84).

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PLCCH Plastic Leaded Chip Carrier with Heat spreader

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PLGA Plastic Land Grid Array Intel term

PPGA

PPGA Plastic Pin Grid Array.

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PQ2 Power Quad flat package type 2

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PSOJ

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PZIP ED-7311-17
CERQUAD 24L.gif
QFI Quad Flat I-leaded package

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QFJ Quad Flat J-leaded package

QFN

QFN Quad Flat Non-leaded package (big heat conducting pad in the bottom)

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QIL Quad In-Line package

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QIP Quad In-line Package

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QTCP Quad Tape Carrier Package

24 lead QUAD

QUAD QUAD in-line package

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QUIL QUad In-Line package

24 lead CERQUAD

QUIP QUad In-line Package

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SD Side-brazed ceramic Dual in-line package

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SECC Single Edge Cartridge Connector Intel term

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SGA Solder Grid Array

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SHRDIL SHRink Dual In-Line (20,24,32,42,52,64)

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SIL Single In-Line (9,13,17)

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SMPAK Super Mini Package Hitachi transistor

6L SO-70

SO-70

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SOD Small Outline Diode

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SOG Small Outline IC with Gull-wing leads

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SOI Small Outline I-leaded package

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SONQFN Small Outline Non-Leaded Package
PSOP 44L.gif
SOP Small Outline Package.

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SP-10 Single in line Package 10 pin Hitachi transistor

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SP-12 Single in line Package 12 pin Hitachi diode
SPAK-5.gif
SPAK Small PAcKage Hitachi transistor

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SRP Small Resin Package Hitachi diode

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SSO Single Small Outline package

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SSP Super Small resin Package Hitachi diode

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TAB Tape Automated Bonding

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TCCN Unknown

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TD Top-brazed ceramic Dual in-line package

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TO-218 Unknown

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TO-251 Unknown
TO-252 or SC-63 3L.gif
TO-252, SC-63 Unknown

TO-263_THIN_9L.gif

TO-263 thin Unknown
TO-263 3L.gif
TO-263 Unknown
TO-243 or SC-62.gif
TO-243, SC-62 Unknown

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TQFN Thin Quad Flat Package with No-Lead

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UMD Ultra Mini Diode Hitachi transistor

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UPAK Uni-Watt Package Hitachi diode

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URP Ultra small Resin Package Hitachi transistor
HVQFN16L.jpg
VQFN Very small Quad Flat No pins
VSO 40L.gif
VSO Very Small Outline (40,56)







Through Hole[edit | edit source]

Chip[edit | edit source]

Image Abbrv Full Name JEDEC/JEITA

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SIP Single In-line Package
SDIP 28L.gif
SDIP Shrink Dual In-line Package
DIP 8L.gif
DIP Dual In-line Package.

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Micro-PGA Micro Pin Grid Array Intel term
Cerdip.gif
CDIP Ceramic Dual In-line Package.
CPGA 223L.jpg
PGA Pin Grid Array. ED-7311-23

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ZIP Zigzag In-line Package

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PDIL Plastic Dual In-Line package
DIP 8L.gif
PDIP Plastic Dual In-Line Package.

24L_CerDIP.gif

CerDIP CERamic Dual In-line Package.

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DIL Dual In-Line (8,14,16,18,20,22,24,28,32,40,48)
CERQUAD 24L.gif
CerQUAD Ceramic quad package
CPGA 132L.jpg
CPGA Ceramic pin grid array, w/ heat spreader
CPGA 223L.jpg
CPGA Ceramic pin grid array



Other[edit | edit source]

Image Abbrv Full Name JEDEC/JEITA
TO-126 3L.gif
TO-126 Unknown
TO-220 15L.gif
TO-220 Unknown

TO247.GIF

TO-247 Unknown

TO262.JPG

TO-262 Unknown

TO264.GIF

TO-264 Unknown
TO-92 3L.gif
TO-92 Unknown
TO-220 7L.gif
TO-220 Unknown
TO-220AB or SC-46.gif
TO-220AB, SC-46 Unknown
TO-220F.gif
TO-220F Unknown
TO-3 4L.gif
TO-3 Unknown
TO-46 2L.gif
TO-46 Unknown
TO-5 10L.gif
TO-5 Unknown

Surface Mount[edit | edit source]

Leads[edit | edit source]

Image Abbrv Full Name JEDEC/JEITA

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DFP Dual Flat Package

PQFP_132L.gif

PQFP Plastic Quad Flat Package ED-7311A
HTQFP 48L.gif
QFP Quad Flat Package (44S10,44S14,48S10,64REC,80REC,100REC,120,128,160)

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QSOP Quarter Size Outline Package (16,20,24,28) or Quality Small Outline Package
SO14.gif
SOIC, SO Small Outline Integrated Circuit (same as SO)
SOIC-WIDE 14L.gif
SOIC (wide) Small Outline Integrated Circuit (wide)
SOIC-NARROW 14L.gif
SOIC (narrow) Small Outline Integrated Circuit (narrow)
SOJ 28L.gif
SOJ Small Outline J-leaded package

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SONB Small Outline Narrow-Body IC with gull-wing leads

SOT-23_3L.gif

SOT-23 Small Outline Transistor.
SQFP 240L.gif
SQFP Shrink Quad Flat Pack (32,48,64,80,208,240)

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SQFP2 Shrink Quad Flat Package with heat sink

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SQFPH Shrink Quad Flat Package with Heat spreader
SSOP 20L.gif
SSOP Small Shrink Outline Package (20,24,28,48,56).

TQFP_100L.gif

TQFP Thin Quad Flat Package

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TQFP2 Thin Quad Flat Package with heat sink

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PSON ED-7311-19

PSOP_44L.gif

PSOP Plastic Small Outline package ED-7311-19

PSOP-2_16L.gif

PSOP-2 Plastic Small Outline package
SSOP 20L.gif
PSSOP ED-7311-20

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PHSOP ED-7311-21

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MQFP Metric Quad Flat Package

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HSOP Heat sinked SOP

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HQSOP Hermetic QSOP (20,24)

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MQFP2 Metric Quad Flat Package with heat sink

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MQFPH Metric Quad Flat Package with Heat spreader

100L_metal_quad.gif

MQUAD Metric QUAD flat package

TSOP1_32L.gif

TSOP 1 Thin Small Outline Package type 1 ED-7311-1

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TSOPII Thin Small Outline Package type II ED-7311-2

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TSQFP Thin Shrink Quad Flat Pack (44,64,100)

TSSOP_24L.gif

TSSOP Thin Shrink Small Outline Package (20,24,28,48,56).

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VQFP Very small Quad Flat Package

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VSOP Very Small Outline Package

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VTQFP Very Thin Quad Flat Package

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VTSOP Very Thin Small Outline Package.
LFPAK 4L.gif
LFPAK
LLDS.jpg
LLDS
MINI SOIC 10L.gif
Mini SOIC
PMFP 8L.gif
PMFP
PSOT 8L.gif
PSOT
SC-70.gif
SO-70
SC-73 4L.gif
SO-73
SC-74A 5L.gif
SO-74A
SC-79.jpg
SO-79
SC-88 or SC-70-6.gif
SO-88, SC-70 6







Leadless[edit | edit source]

Image Abbrv Full Name JEDEC/JEITA
LCC 28L.gif
LCC Leadless Chip Carrier or Leadless Ceramic Carrier
QCCN 32L.gif
QCCN
SC-101.gif
SC-101
LLP 2.0 8L.gif
LLP

LAMINATE_CSP_128L.gif

CSP Laminated Chip Scale Package.

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LCCC Leadless Ceramic Chip Carrier

LAMINATED_UCSP_32L.gif

UCSP LAMINATED U chip scale package

LAMINATED_TCSP_24L.gif

TCSP LAMINATED T chip scale package
HVQFN 48L.gif
HVQFN

Ball Grid Array(BGA)[edit | edit source]

Image Abbrv Full Name JEDEC/JEITA

TFBGA_128L.gif

TFBGA Thin-profile Fine-pitch Ball Grid Array
HBGA 456L.gif
HBGA
SHELLOP 36L.gif
SHELLOP

UFBGA_100L.gif

FBGA,FPBGA Fine Pitch Ball Grid Array.

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CBGA Ceramic Ball Grid Array.

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µBGA Micro Ball Grid Array.
FBGA 100L.gif
PFBGA Plastic Fine Pitch Ball Grid Array 0.5mm ED-7311-7
FBGA 100L.gif
PFBGA Plastic Fine Pitch Ball Grid Array 0.8mm ED-7311-8

FBGA_49L.gif

FBGA,FPBGA Fine Pitch Ball Grid Array.
File:TFBGA 324L.gif
TEPBGA Thermally Enhanced Plastic Ball Grid Array

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LFBGA Leadless Fine Pitch Ball Grid Array

EBGA_268L.gif

EBGA Enhanced Ball Grid Array

PBGA_481l.gif

PBGA Plastic Ball Grid Array.
TEPBGA 324L.gif
LCBGA Low Cost Ball Grid Array.

MICRO_ARRAY_16L.gif

Micro-Array Micro array

MICRO_SMD_42L.gif

Micro-SMD Micro surface mount device

List of IC package names[edit | edit source]

Through-hole[edit | edit source]

DIL: Dual-Inline[edit | edit source]

  • DIP: Dual inline package 0.6" [1]
  • Skinny DIP: Skinny Dual inline package 0.3" [2]
  • CERDIP CDIP: Ceraminc Dual inline package [3]
  • PDIP, PDIL: Plastic Dual In-Line package
  • SDIP, SHRDIL: Shrink Dual inline package
  • SPDIP: Shrink Plastic Dual In-line Package
  • Hybrid DIP: Hybrid Dual In-line Package
  • SBDIP: Side Brazed Dual In-line Package

[4]

  • SBDIP-H: Side Brazed Dual In-line Package Hybrid [5]
  • BBDIP-H: Bottom Brazed Dual In-line Package Hybrid [6]

SIL: Single-Inline[edit | edit source]

  • SIP: Single in-line package

PGA: Pin Grid Array[edit | edit source]

  • PGA: Pin grid array
  • PPGA: Plastic pin grid array
  • FCPGA: flip-chip pin grid array
  • CPGA: Ceramic pin grid array
  • OPGA: Organic pin grid array
  • FC-PGA: Flip Chip Pin Grid Array (Intel)
  • Micro-PGA: Micro Pin Grid Array Intel term


ZIP[edit | edit source]

  • ZIP: zig-zag in-line package
  • PZIP: plastic zig-zag in-line package



Surface Mount[edit | edit source]

J-Lead[edit | edit source]

DIL: Dual Inline[edit | edit source]

SOIC: Small Outline Integrated Circuit[edit | edit source]
  • SOIC-N-EP: Small outline integrated circuit narrow body with exposed pads with heatsink [7]
  • batwing SOIC, SOIC-BAT: Small outline integrated circuit thermally enhanced with fused leads (batwings) [8]
  • Mini-SOIC: Mini Small outline integrated circuit JEDEC: MO-187-AA [9]


SO: Small Outline[edit | edit source]
  • SO-70
  • SO-73
  • SO-74A
  • SO-79
  • SO-88, SC-70 6-lead [10]
  • SSO: Single Small Outline package
  • VSO: Very Small Outline


SOP: Small outline package[edit | edit source]
  • SOP, SO, SOIC: Small-Outline Package
  • PSOP: Plastic Small-Outline Package
  • PSOP-2: Plastic Small Outline package thermally enhanced with heatsink on top [11]
  • PSOP-2: Plastic Small Outline package thermally enhanced with heatsink on bottom [12]
  • PSSOP: Plastic Shrink Small-Outline Package
  • TSOP: Thin Small-Outline Package
  • TSOP I: Thin Small Outline Package type 1
  • TSOP II: Thin Small Outline Package type II
  • TSSOP: Thin Shrink Small Outline Package [13]
  • TSSOP: Thin Shrink Small Outline Package with Exposed Pad (on bottom) [14]
  • Wide-TSSOP: Wide Thin Shrink Small Outline Package [15]
  • SSOP, Shrink SO: Shrink Small-Outline Package [16]
  • QSOP: Shrink Small-Outline Package [17]
  • QSOP-EP: Shrink Small-Outline Package [18]
  • HSOP: Heat sinked Small-Outline Package
  • HQSOP: Hermetic Quad Small-Outline Package
  • VSOP: Very Small Outline Package
  • uSOP, uMAX: micro Small Outline Package
  • MSOP, micro-SOIC: Mini Small Outline Package [19]
  • MSOP-EP: Mini Small Outline Package Exposed pads [20]


SOT: Small outline transistor package[edit | edit source]

Small Outline Transistor package

  • PSOT
  • SOT-23: Small Outline Transistor package (3,5,6, or 8 Leads) [21]
  • SOT-66: Small Outline Package [22]
  • SOT-89: Small Outline Package
  • SOT-143: 4 Lead Small Outline Transistor Package [23]
  • SOT-223: Small Outline Transistor Package (4 or 5 Leads) [24]
  • TSOT-23: [25]


SC[edit | edit source]
  • SC-101
  • SC-70: Shrink Small outline transistor [26]

QIL: Quad Inline[edit | edit source]

QFP: Quad Flat Package[edit | edit source]

The quad flat package (QFP) is a thin flat square or rectangular package with J-Leads on all 4 sides.

  • QFP: Quad Flat Package
  • BQFP: Bumpered Quad Flat Package
  • BQFPH: Bumpered Quad Flat Package with Heat spreader
  • CQFP: Ceramic Quad Flat Package
  • FPQFP, FQFP: Fine Pitch Quad Flat Package
  • HQFP: Heat sinked Quad Flat Package
  • LQFP: Low Profile Quad Flat Package
  • MQFP, MQUAD: Metric Quad Flat Package [27]
  • MQFP2: Metric Quad Flat Package with heat sink
  • MQFPH: Metric Quad Flat Package with Heat spreader
  • PQFP: Plastic Quad Flat Package
  • SQFP: Small Quad Flat Package
  • TQFP: Thin Quad Flat Package [28]
  • TSQFP: Thin Shrink Quad Flat Pack
  • VQFP: Very small Quad Flat Package
  • VTQFP: Very Thin Quad Flat Package
  • SQFP2, SQFPN: Shrink Quad Flat Package with heat sink
  • TQFP2: Thin Quad Flat Package with heat sink

Leadless[edit | edit source]

QFN: Quad flat package, no-leads[edit | edit source]

  • QFN - quad flat non-leaded package [29]
  • PQFN - power quad flat non-leaded package
  • SONQFN: Small Outline quad flat non-leaded package
  • TQFN: Thin quad flat non-leaded package
  • VQFN: very small quad flat non-leaded package
  • HVQFN:Heatsink Very-thin Quad Flat-pack No-leads [30]
  • DR QFN:
  • DQFN: Depopulated very-thin Quad Flat-pack No-leads [31]

SON: Small outline package, no-leads[edit | edit source]

  • SON: Small outline package, no-leads
  • PSON: Plastic Small outline package, no-leads
  • XSON, MicroPak: eXtremely thin Small Outline No leads [32]


BGA: Ball grid array[edit | edit source]

  • BGA: Ball grid array
  • BGA1: Ball grid array (Intel)
  • BGA2: Ball grid array (Intel)
  • CBGA: Ceramic ball grid array [33]
  • PBGA: Plastic ball grid array
  • FBGA, FPBGA: Fine pitch ball grid array
  • LFBGA - low profile fine pitch ball grid array JEDEC Standard No. 75, JESD75 [34]

[35]

  • μBGA - micro-ball grid array
  • HBGA Heat Spreader Ball Grid Array
  • HBGA: Hybrid Ball Grid Array [36]
  • TFBGA: Thin-profile Fine-pitch Ball Grid Array
  • PFBGA: Plastic Fine Pitch Ball Grid Array 0.5mm
  • PFBGA: Plastic Fine Pitch Ball Grid Array 0.8mm
  • TEPBGA: Thermally Enhanced Plastic Ball Grid Array
  • EBGA: Enhanced Ball Grid Array
  • LCBGA: Low Cost Ball Grid Array
  • CSBGA: [37]
  • VFBGA: very-thin, fine-pitch ball grid array JEDEC JC-11 registration - MO-225 [38]

[39]

  • Micro-Array
  • Micro-SMD
  • CSPBGA: Chip Scale Package Ball Grid Array [40]
  • SBGA: Thermally Enhanced Ball Grid Array with Heatsink [41]

Others to be sorted[edit | edit source]

CSP
  • CSP: Wafer level chip scale package
  • WL-CSP, WLCSP, WCSP, Nanostar: Wafer level chip scale package
  • UCSP: LAMINATED U chip scale package [42]
  • TCSP: LAMINATED T chip scale package
  • LFCSP: LeadFrame chip scale package
WLP
  • WLP: Wafer level package
CGA
  • CCGA - ceramic column grid array
  • CGA - column grid array
LGA
  • LGA: land grid array
  • PLGA: Plastic land grid array
  • CLGA: Ceramic land grid array
  • PILGA:
  • CSLGA: [43]





SOJ
  • SOJ: small outline J-lead
  • HSOJ: Heat sinked small outline J-lead
  • PSOJ: plastic small outline J-lead


LCC, QFJ
  • LCC, QFJ - Leadless Chip Carrier [44]
  • PLCC, PQFJ, : plastic leaded chip carrier [45]
  • CLCC, CQFJ, LCCC: ceramic leaded chip carrier
TO
  • TO-3
  • TO-5 Plastic Header Package with flat index thru-hole [46]
  • TO-8: Metal Header Package thru-hole [47]
  • TO-46
  • TO-51: Metal Header Package thru-hole [48]
  • TO-51: Metal Header Package thru-hole
  • TO-52: Metal Header Package thru-hole [49] [http://pdfserv.maxim-ic.com/package_dwgs/21-0019.PDF
  • TO-78: Metal Header Package thru-hole [50]
  • TO-92 Plastic Header Package with flat index thru-hole [51]
  • TO-99: Metal Header Package thru-hole [52]
  • TO-100: Metal Header Package thru-hole [53]
  • TO-126
  • TO-218
  • TO-220
  • TO-220AB, SC-46
  • TO-220F
  • TO-243, SC-62
  • TO-247
  • TO-251
  • TO-252, SC-63, DPAK
  • TO-262
  • TO-263 thin
  • TO-263, D2PAK
  • TO-264
  • TO-268, D3PAK








CO chip-on, Non-packaged devices
  • COB - chip-on-board
  • COF - chip-on-flex
  • COG - chip-on-glass


PAK
  • DPAK: Deca-Watt Package (Hitachi) transistor
  • HDPAK: Huge Deca-watt PAcKage (Hitachi) transistor
  • LDPAK: Large Deca-watt PAcKage (Hitachi) diode
  • MPAK: Mini PAcKage (Hitachi) transistor
  • SMPAK: Super Mini Package (Hitachi) transistor
  • SPAK: Small PAcKage (Hitachi) transistor
  • UPAK: Uni-Watt Package (Hitachi) diode
  • LFPAK
MLP
  • MLP: Micro Lead Frame Package
  • MLF: MicroLeadFrame (Amkor)
  • MLFQ: Micro Lead Frame Quad Package (Quad)
  • MLFD: Micro Lead Frame Package (Dual)
  • SP: Single in line Package (Hitachi) transistor
  • SRP: Small Resin Package (Hitachi) diode
  • SSP: Super Small resin Package (Hitachi) diode
  • UMD: Ultra Mini Diode (Hitachi) transistor
  • URP: Ultra small Resin Package (Hitachi) transistor
  • TAB: Tape Automated Bonding
  • MELF: Metal ELectrical Face
  • MLP - Leadframe package
  • TCCN:
  • CASON: Chip Array Small Outline No Lead
  • CERQUAD: CERamic QUAD in-line package
  • CMPAK: Compact Mini PAcKage Hitachi diode/transistor
  • CerPack: CERamic flatPACK
  • SOD - Small outline diode


  • SOG: Small Outline IC with Gull-wing leads
  • DSO: Dual Small Outline package
  • EQUAD
  • FC: Flip Chip
I-leaded package
  • QFI: Quad Flat I-leaded package
  • HQFI: Heat sinked Quad Flat I-leaded package
  • SOI: Small Outline I-leaded package
  • HSOI: Heat sinked Small Outline I-leaded package


  • LLD: LeadLess Diode (Hitachi)
  • QFJ: quad flat J-lead
  • LRP: Large Resin Package (Hitachi) diode


  • MOP: Mini Oct-Lead Package (Hitachi) transistor
  • PLCCH: Plastic Leaded Chip Carrier with Heat spreader
  • PQ2: Power Quad flat package type 2
  • QIL, QIP,QUIP, QUAD, QUIL: Quad In-line Package
  • QTCP: Quad Tape Carrier Package
  • SD: Side-brazed ceramic Dual in-line package
  • SECC: Single Edge Cartridge Connector (Intel)
  • SGA: Solder Grid Array
  • MELF: Metal ELectrical Face
  • MLP - Leadframe package
  • TD: Top-brazed ceramic Dual in-line package
  • CerQUAD: Ceramic quad package
  • DFP: Dual Flat Package
  • SONB: Small Outline Narrow-Body IC with gull-wing leads
  • LLDA
  • PMFP
  • LCC: Leadless Chip Carrier or Leadless Ceramic Carrier
  • LCCC: Leadless Ceramic Chip Carrier


  • QCCN
  • LLP


  • SHELLOP
  • MicroDFN, uDFN: [54]
  • Ultra Thin MicroDFN: [55]
  • SideBraze [56]
  • WLP: WAFER LEVEL PACKAGE
  • BCC:
  • LPCC:
  • MFL:
  • PoP: Package-on-Package


  • FLATPACK: Ceramic Flat Package [57] [58]

See also[edit | edit source]

External links[edit | edit source]

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