How to identify chip packages

This page contains all computer chip or integrated circuit packages. A chip package is what surrounds the integrated circuit die and connects the die's pads to the packages external pins.

Types of Leads/Contacts

• J-Lead
• Gull-wing Lead
• C-Bend Lead
• I-Lead
• Bat-wing Lead
• Through-Hole Lead
• Exposed Pad
• Ball (solder ball)
• Tab (Heatsink)
• Land pad (Non-leaded/No-lead)
• Pin
• Column

Common Packages

• CPGA: Ceramic pin grid array
• PDIP: Plastic dual in-line package
• BGA : Ball grid array
• SO: Small outline
  • SOIC: Small outline intergrated circuit
  • SOT-23: Small outline transistor 23
• PQFP: Plastic quad flat package
• PLCC: plastic leaded chip carrier
• TO: transistor outline

Chip packages

• In-line package
  • DIP
  • SIP
  • ZIP

• Optical package
  • Photodiode
  • LED
  • IR
  • Photo interrupt

• Pin grid array
• PGA

• Small outline package:
  • SO
  • SOP
  • SOIC
  • SOT
  • SC

• Transistor outline
  • TO

• Ball grid array
  • BGA
  • CSP
  • Micro-array
  • MicroSMD
  • CGA: Column grid array

• Quad package
  • QFP

• Leadless package
  • QFN
  • SON
  • LGA

• J-lead package
  • SOJ
  • LCC

• 2 lead package
  • Diodes
    • DO
    • SOD
  • Resistors
  • Capacitors
  • inductors

• I-lead package
  • CERPACK
  • CERQUAD
  • QFI
  • SOI

• Non-standard

• Unsorted

Chip Carrier Related Acronyms

• COL: Chip-on-Lead
• TEP: Top Exposed Pad
• EP, EXP: Exposed pad
• L, LD: Lead
• SiP: System in Package
• JEDEC: Joint Electron Device Engineering Council
• JEITA: Japan Electronics and Information Technology Industries Association
• SoC: System on Chip
• ASIC: Application specific Integrated circuit
• Pb: lead
• Sn: tin
• Cu: Copper
• Ag: Gold
• EIA: Electronic Industries Alliance
• MCP: Mult-Chip Package
• EIAJ: Electronic Industries Association of Japan
• TAB: Tape Automated Bonding

See Also

• Guide to computer chip or integrated circuit identification

External Links

• JEITA package standards downloads
• http://www.standardics.nxp.com/packaging/package.outlines/
• http://www.nxp.com/package/
• http://www.analog.com/Analog_Root/Packages/Packages_Home/0,2299,1,00.html
• *http://www.amkor.com/products/productfamilies.cfm

• http://acronyms.thefreedictionary.com/

New links

• http://www.talkingelectronics.com/projects/CircuitTricks/CircuitTricks-1.html
• GOOD: http://icmaster.co.kr/Semi/hitachi/pdf/pkg.pdf
• GOOD: http://ww1.microchip.com/downloads/en/EnvironmentalInformation/en026304.pdf
• http://sti-lt.ac-rouen.fr/Microtechniques/BTS_CIM/Articles/Doc%20Microship.pdf
• ALL ee words: http://cpu.linuxmania.net/liste/cpuinfo/chip-abbreviations.htm
• http://productsearch.machinedesign.com/Specifications/Semiconductors/Discrete/Thyristors/Silicon_Controlled_Rectifiers_SCR

• PiP

• http://www.statschippac.com/en-US/STATSChipPAC/IntegratedServices/Packaging/LeadFrame/bcc.htm

• http://www.educypedia.be/electronics/componentfabricationchip.htm
• package photos

• NEC
• Intersil
• ROHM
• Sony
• TI
• http://www.pcmag.com/encyclopedia_term/0,2542,t=chip+package&i=39645,00.asp
• SMD components
• http://www.fpga-guide.com/package/package.html
• SMD Dictionary
• BGA Packages
• http://www.2ic.cn/bbs/viewthread.php?tid=287902
• http://www.upv.es/amiga/198.htm (Spanish)

completed

• Analog devices
• Amkor
• Fairchild

• old packages