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Soldering surface-mount components, also known as SMT or SMD, is completely different than soldering through-hole components. They are not only smaller but need a completely different technique of soldering. The old adage of heating metal first, not the solder, does not work with SMD components. Different SMD components also require different techneques.

Chip resistors, capacitors, inductors, and tantalum capacitors

The technique for soldering chip resistors, chip capacitors, chip inductors, and tantalum capacitors are the same. Each of the above can be soldered using an inexpensive soldering iron with a fine tip. Working with integrated circuits, because of the close spacing of the pins, requires different tools and techniques in order to be successful.

  • Sizes
    • chip resistor, chip capacitor, and chip inductor
      • 1210
      • 1206
      • 805
      • 603
      • 402
      • 201
      • Less Common (larger): 6927, 4527, 3637, 2515, 2512, 2012, 2010, 1812

=Chip resistor/capacitor arrays or networks

Gull-wing chips

large pitch

small pitch

Quad flat package (QFP)

Ball grid array (BGA)

Ball grid arrays, BGAs, can not be soldered by hand.

I have tried, and gotten close, but its not worth it. The method that almost worked was: I leveled the board, raised above the table about 3cm. With tweezers and care, i placed the BGA on the pads. Then I lay the soldering iron underneath the board, no contact with the board. And they wait. The board heats up, and so do the solder balls on the BGA. After i was certain the solder was melted, I carefully removed the iron and let it cool. And after all the, there was shorts. So I never waisted my time on that again. User:ZyMOS

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